JPH0220155B2 - - Google Patents
Info
- Publication number
- JPH0220155B2 JPH0220155B2 JP22523583A JP22523583A JPH0220155B2 JP H0220155 B2 JPH0220155 B2 JP H0220155B2 JP 22523583 A JP22523583 A JP 22523583A JP 22523583 A JP22523583 A JP 22523583A JP H0220155 B2 JPH0220155 B2 JP H0220155B2
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- metal plates
- metal
- adhesive
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 94
- 239000002184 metal Substances 0.000 claims description 94
- 238000000034 method Methods 0.000 claims description 45
- 238000004519 manufacturing process Methods 0.000 claims description 29
- 238000007747 plating Methods 0.000 claims description 27
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 229910052782 aluminium Inorganic materials 0.000 claims description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 24
- 230000002093 peripheral effect Effects 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 229910000976 Electrical steel Inorganic materials 0.000 claims description 9
- 238000005304 joining Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 238000004070 electrodeposition Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 239000010410 layer Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 239000002313 adhesive film Substances 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 9
- 238000005530 etching Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229920006332 epoxy adhesive Polymers 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005554 pickling Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000011253 protective coating Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 238000007743 anodising Methods 0.000 description 3
- 238000003618 dip coating Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22523583A JPS60116189A (ja) | 1983-11-29 | 1983-11-29 | 金属基材配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22523583A JPS60116189A (ja) | 1983-11-29 | 1983-11-29 | 金属基材配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60116189A JPS60116189A (ja) | 1985-06-22 |
| JPH0220155B2 true JPH0220155B2 (en]) | 1990-05-08 |
Family
ID=16826106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22523583A Granted JPS60116189A (ja) | 1983-11-29 | 1983-11-29 | 金属基材配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60116189A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60157288A (ja) * | 1984-01-25 | 1985-08-17 | イビデン株式会社 | 金属基材配線板の製造方法 |
| JP2008283226A (ja) * | 2000-10-18 | 2008-11-20 | Nec Corp | 半導体装置搭載用配線基板およびその製造方法、並びに半導体パッケージ |
-
1983
- 1983-11-29 JP JP22523583A patent/JPS60116189A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60116189A (ja) | 1985-06-22 |
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